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Job Title: Component Design Engineer Company: Intel, Hillsboro, OR, USA. (March 2006 to Sept 2017) - Transistor and chip-level data analyst on the latest generations of microprocessors. - Expert in transistor compact modeling of Digital, Analog, SRAM, RF transistors using Intel`s internal models and industry models (BSIM4 and PSP). - Worked on all industry standard nodes from 180nm to 7nm (including FINFET model process files for 22 nm, 14 nm, 10 nm, and 7nm nodes). Experience in low power CMOS design (analog, digital, SRAM). Design, layout and measurement of analog, digital and RF circuits. - Coding experience with C/C++, Visual Studio, Linux BASH, Perl, Python, Git, MATLAB, SPICE, Circuit simulation, JMP, VBA (Visual Basic) for data analysis, data visualization, model evaluation, scripting, and debugging. Basic understanding of SQL, Tcl, JavaScript, HTML (building websites). - Worked as a quality assurance (QA) Engineer for checking accuracy of models (wrote scripts and created visualization tools to ensure error-free model delivery). - Worked on improving compact models to explain novel experimental and simulated results in transistor behavior (the introduction of novel parameters in the model to improve model accuracy, collection of data over wider range of conditions to improve understanding of circuit behavior) - Worked on optimization algorithms to adjust parameters to auto-fit experimentally measured circuit data. Introduced novel equivalent circuits to improve data fitting for macro-circuit blocks. Analyzed large-volume transistor data for process corner fits and statistical analysis. SKILLSET AND EXPERTISE - Strong fundamentals in electrical engineering, device measurement, and semiconductor fabrication. - Led compact model teams and coordinated work with cross functional teams in TCAD simulation, process integration, manufacturing and design (both internal and foundry groups) to meet performance targets for Intel’s cutting-edge process nodes, including the introduction of the first FINFET transistors. - TCAD tools (Intel internal tools, T-Suprem4, MiniMOS) and Electromagnetic modeling of backend interconnects and vias (resistance, capacitance, inductance estimations). - Have hands on experience working in a microfabrication and nanofabrication laboratory. - Lab experience on oscilloscopes and spectrum analyzers (LABVIEW, C, instrument control languages) and characterization of semiconductor devices. ©